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CDS Electronics offers a wide range of silver conductive adhesives, resins and underfill encapsulate, that match the requirements of the semiconductor industry and the manufacture of electronic components. | |||||
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CDS offers the technology developed by DIEMAT (USA) and manufactured in Japan today by NAMICS, glass seals at low temperature (320-400 ° C). These products are available in pasta, but preforms tailored to customer needs. | |||||
| Part number | T ° sintering | Process | Comments | |||
| DM 3030 / H974 | 300 – 350 °C | dosing syringe | Silver conductive paste bonding chip <18 mm diameter (alternative solder gold / tin) |
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| DM 2700P / J105 | 320 – 375 °C | Screen printing, stencil, syringe | Sealing materials with low CTE | |||
| DM 2700 PF | 320 – 375 °C | Preform according to customer's drawing | Sealing optical fibers without metallization | |||
| DM 2995 P | 350 – 420 °C | Screen printing, stencil, syringe | Lead-free glass (RoHS) same applications DM2700 P | |||
| DM 2995 PF | 350 – 420 °C | Preform according to customer's drawing | Lead-free glass (RoHS) same application DM 2700 PF | |||
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