 |
|||||||||
 |
CDS Electronics offers a wide range of silver conductive adhesives, resins and underfill encapsulate, that match the requirements of the semiconductor industry and the manufacture of electronic components. | ||||||||
     
|
|||||||||
 |
The range of underfill CHIPCOAT can fill by capillary interstices between the welding points of an integrated circuit mounted on a substrate (flip-chip applications or CSP-BGA) | ||||||||
| Underfill pour Flip-Chip (UF) | |||||||||
| Part numbers | Characteristics | Dimension filler moy /Max (µm) | Viscocity (Pa -Sec) | Tg (°C) | Elasticity module(Mpa) | CTE < Tg (ppm) | CTE > Tg (ppm) | ||
| U8432-2 | For Pb free application | 2.0/10 | 40 | 137 | 8 | 32 | 100 | ||
| U8443-14 | Pb free, narrow gaps | 0.3/3 | 10 | 135 | 6.5 | 42 | 125 | ||
| U8410-76 | For low K application, Pb free | 2.0/10 | 30 | 97 | 11 | 31 | 97 | ||
| U8410-73C | Low K, Pb free, narrow gaps | 0.6/3 | 50 | 88 | 11.5 | 31 | 95 | ||
| Underfill pour CSP-BGA (SUF) | |||||||||
| Part numbers | Characteristics | Viscocity (Pa -Sec) | Tg (°C) | Elasticity module(Mpa) | CTE < Tg (ppm) | CTE > Tg (ppm) | |||
| SUF1589-1 | High fiability | 10 | 120 | 3 | 60 | 190 | |||
| Ohmcoat 1572 | For injection application (low viscocité) | 0.7 | 140 | 13 | 23 | 80 | |||
|
|||||||||
 |
|||||||||
