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CDS Electronics offers a wide range of silver conductive adhesives, resins and underfill encapsulate, that match the requirements of the semiconductor industry and the manufacture of electronic components. | ||||||
     
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Resins (dam and fill) CHIPCOAT allow encapsulating type links bonding-wire ensuring reliability of connections in a volume delimited by the application of a bead of resin (dam) which holds the encapsulating resin (fill) of smaller viscocité. | ||||||
| Part numbers | Characteristics | Viscocity( Pa-Sec) | Tg (°C) | Elasticity module(Mpa) | CTE < Tg (ppm) | CTE > Tg (ppm) | |
| Chipcoat G8345D | Resin bead (dam) | 55 | 145 | 17 | 15 | 60 | |
| Chipcoat G8345D-37 |
Resin Cord (dam) with charges (filler) | 60 | 140 | 10 | 25 | 70 | |
| Chipcoat G8345-6 |
Resin (fill)- high fluidity | 60 | 145 | 18 | 15 | 50 | |
| Chipcoat G8345-29 | Resin (fill) with charges (filler) | 35 | 140 | 17 | 17 | 60 | |
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