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CDS Electronics offers a wide range of silver conductive adhesives, resins and underfill encapsulate, that match the requirements of the semiconductor industry and the manufacture of electronic components. | |||||
     
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Silver conductive adhesives UNIMEC meet the technical needs of a majority of bonding type applications: die-attach, LED, substitution welding components. Since the acquisition of DIEMAT by NAMICS the offer was extended to adhesive with high thermal conductivity. | |||||
| Part numbers | Characteristics | Application | Adhesion strength (N/mm2) | Process condition | Volume resistivity (Ohm.cm) | |
| H 9626 | Excellent adhesion | Bonding components | 40 | Screening/150°C 30 min | 1.5 10-4 | |
| H 9654 | Low drying temperature . |
Bonding components | 25 | 0.5 10-4 | ||
| H 9683 | High thermal conductivity excellent adhesion | Die attach QFP-QFN | 18 | Dispensing/ 150°C 60 min | 0.5 10-4 | |
| DM6030 Hk F954 | High thermal conductivity Storage T ° ambient | Power Electronics | 13 | Dispensing-Screening/ | 0.08 10-4 | |
| XH 9890-2L | Low temperature Ag sintering Cth= 176 W/m.K | Subsitution high T °welding | 50 | Dispensing/ 200°C 60 min | 0.04 10-4 | |
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